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All technologies for the self-adhesive label industry at the Flexo & Labels 2024

Join our team in São Paulo during Flexo & Label 2024 from June 25th to 28th in the Anhembi District.

At this event, Elkem will present all the technologies for the self-adhesive label industry.

"Ready-to-Use" UV curing or Solventless thermal curing system?

We are able to offer these and other options to promote non-adhesion for labels, tapes and other graphic products. We will present all these solutions at our stand during the Flexo & Labels 2024 fair.

Come and meet our team, we will be waiting at booth 01H. To register, access HERE

Silcolease™ 有机硅离型剂

本指南将为您提供更多有关有机硅在 "离型涂层 "应用和基材选择方面的信息。

埃肯与可持续发展

如要了解我们可持续发展计划的详细信息,请访问我们的网页。

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与全球领先的材料制造商携手,将您的企业提升到一个新的水平。